Liquid Cooling for high-density data centers
When high density requires liquid cooling
The increase in IT performance, especially for AI and HPC applications, is driving rack power density to levels that air cooling alone can no longer handle.
DataDom designs modular data centers ready for liquid cooling, integrating air and water into a coherent, scalable, and reliable system.
In high-density data centers, DataDom integrates liquid cooling from the very beginning of the infrastructure design.
In high-density data centers, DataDom integrates liquid cooling from the very beginning of the infrastructure design.
When liquid cooling becomes the right choice
Liquid cooling is applied where per-rack loads reach levels that air cooling can no longer manage efficiently and reliably.
Direct-to-chip liquid cooling
Direct-to-Chip Liquid Cooling (D2C) is the liquid cooling solution that most closely resembles the operation of traditional rack-based systems. The coolant circulates inside the server and removes heat directly from critical components, such as chipsets and GPUs, through heat exchangers positioned on the microprocessor.
This approach enables highly efficient cooling by targeting only the components that generate heat, making the system easily integrable even in existing data centers.
Main advantages:
- Targeted, high-efficiency cooling directly at the source,
- Simplified integration without invasive structural modifications.
The system uses simple, low-impact fluids, but requires careful piping management to ensure long-term reliability.
Immersion cooling
In immersion liquid cooling, the entire server is submerged in a dielectric fluid, capable of absorbing the heat generated by the components and transferring it to an external heat exchanger.
Cooling occurs in a uniform and continuous manner, drastically reducing operating temperatures even under very high loads.
It is a more complex solution from an infrastructure and operational management perspective, but particularly effective for ultra-high power density applications.
Key features:
- extremely efficient and uniform heat dissipation
- management of very high heat loads with reduced noise and vibration
Hybrid solutions: air and water combined
Even in liquid cooling systems, part of the heat is released into the environment.
For this reason, DataDom data centers combine liquid cooling for critical components with air cooling to manage residual heat.
The goal? Leverage the strengths of both technologies to enhance operational continuity.
The goal? Leverage the strengths of both technologies to enhance operational continuity.
The DataDom approach to liquid cooling
DataDom integrates liquid cooling at the infrastructure level, as part of the overall data center design, and only in high-density contexts where it is truly necessary.
The infrastructures are designed from the earliest stages to accommodate liquid cooling, avoiding corrective interventions or invasive reconfigurations over time.
Depending on project requirements, DataDom data centers can be prepared for:
- Integration of Direct-to-Chip systems
- Preparation for Immersion Liquid Cooling for ultra-high-density applications
- Use of hybrid systems that combine liquid and air cooling in a coordinated way.
The result is a modular and reliable infrastructure in which liquid cooling is not an add-on, but a coherent design choice, developed to support high IT loads and evolving AI-driven scenarios.
